Tag: wafer-on-wafer

Graphcore has introduced a groundbreaking 3D AI chip utilizing wafer-on-wafer technology, promising significant advancements in AI processing capabilities and efficiency. This innovative approach stacks multiple silicon wafers directly on top of each other, enabling denser integration and faster communication between processing units.

Graphcore has unveiled its latest innovation, the Bow IPU, utilizing a novel wafer-on-wafer (WoW) stacking technology. This advancement promises significant improvements in performance and power efficiency for AI and machine learning workloads, marking a new era for specialized AI hardware.