Tag: semiconductor packaging

Alchip and Ayar Labs are collaborating on advanced co-packaged optics solutions, a critical development for scaling AI datacentres. This product deep-dive explores the technology, its implications, and the potential impact on the future of high-performance computing.

Alchip and Ayar Labs are collaborating to develop and deploy co-packaged optics (CPO) solutions, a significant advancement for AI and high-performance computing datacenters. This partnership aims to address the escalating demands of AI workloads by enhancing interconnectivity and reducing power consumption, paving the way for more scalable and efficient datacenters.